Parameter:

Layers: 6L

material: FR-4+PI

Board Thicknes: 1.6 mm

Copper Thicknes: 35 um

Line/Space: 5/5 mil

Smallest Hole Diameter: 0.2mm

Surface Treatment: ENIG(1U")

Technical Feature:

Rigid-Flex, Resin plugging

Application:

Computer, Communication, Medical, Auotomobile, Aerospace, Military