Technical Parameters
Part Number：GHM08C02008A0 
Layer count: 3 stage 10 layer
Board thickness：1.6mm
Dimension：141*110.88mm
Raw material：FR4 EM825
Copper thickness on the board surface：≥35um
Copper thickness in the hole barrel：20um
Min.line width/space：0.10mm
Minimum hole diameter：0.10mm 
Surface finishing：immersion gold≥1u"
Application：monther board of POS device