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8L Rigid-Flex Immersion Gold Board

8L Rigid-Flex Immersion Gold Board

8L Rigid-Flex Immersion Gold Board

Parameter
Layers: 8L
material: FR-4+PI
Board Thicknes: 1.2 mm
Copper Thicknes: 35 um
Line/Space: 3/3 mil
Smallest Hole Diameter: 0.2mm
Surface Treatment: ENIG(2U")

Technical Feature:
Rigid-Flex

Application:
Communication

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